Samsung's upcoming Exynos 2700 chipset, expected to power the Galaxy S27 and S27+, may feature a significant change in its packaging design.The company is reportedly moving away from Fan-Out Wafer-Level Packaging (FOWLP), a technology previously used in the Exynos 2400.While FOWLP improved thermal performance, its complex and costly manufacturing process made it less profitable for Samsung.

The new architecture, called Side-by-Side (SbS), places the application processor (AP) and DRAM next to each other on the substrate, rather than stacking them.This design is intended to simplify production and reduce costs.

Additionally, Samsung plans to incorporate its Heat Pass Block (HPB) technology into the Exynos 2700, which is expected to enhance heat dissipation and overall thermal efficiency.

The Galaxy S27 series is anticipated to launch in early 2027, and the performance and efficiency of the Exynos 2700’s new packaging will be closely observed by tech enthusiasts.Overall, the change marks a strategic move to balance performance improvements with cost-effective production.